Super Micro Computer, Inc.
 

Products
SuperServer®
Storage
Motherboards
Chassis
SuperWorkstation
SuperBlade®
MicroBlade™
Ultra (new)
WIO
Twin Solutions (new)
MP Servers
GPU / Coprocessor
MicroCloud
Networking
Embedded
Gaming
AMD Solutions
Power Supplies
Accessories
SuperRack®
Server Management


NEW! X11 (Skylake-SP) Solutions Brochure



NEW! X11 (Skylake-SP) Solutions Video



X11 Solutions Launch Video



X11 Product Loop Video



Case Study: Deliver IT Equipment For Evolving Business Opportunities



Success Story: Enabling New Levels Performance And Efficiency For Real-Time Data Analytics For SQL Data Warehouse Deployments



Fortune100 Case Study: MicroBlade



Solution Brief




Catalog:

SuperServer®
Motherboards
Chassis
SuperBlade® &
  MicroBlade



Press Releases:

New X11 Solutions
New Supermicro RSD



Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Ultra | Twin | FatTwin | DCO | WIO | GPU | Mainstream | Storage | Workstation | Max IO |


  SuperServer® SKUs -  | ALL | 1U | 2U | 3U/4U | UP | DP | MP | Socket P (E5) / H4 (E3) |

 Supermicro SuperServer®

Supermicro's X11 DP and UP SuperServer®, SuperWorkstation, SuperStorage, and SuperBlade® solutions offer numerous advantages over previous generations and the highest levels of performance, efficiency, security and scalability in the industry. Supermicro X11 SuperServers support the latest Intel® Xeon® Scalable processors and offer 3TB ECC 3DS LRDIMM or RDIMM DDR4-2666MHz memory in 24 DIMMs, 7 PCI-E slots, SAS 3.0/SATA 3.0/NVMe hot-swap HDD/SSD support, 10GBase-T/10G SFP+/56Gbps FDR InfiniBand networking options, redundant Titanium Level (96%+) Digital power supplies, and IPMI 2.0 plus KVM with dedicated LAN. The SuperWorkstation systems offer in addition 7.1 HD Audio, and up to 11 USB ports.

The Supermicro X11 DP and UP solutions are offered in the industry's broadest variety of form factors, including 1U, 2U, 3U/Mini-Tower, 4U/Tower, and 8U SuperBlade® addressing the widest array of product/market and application segments:

  • Data Center Optimized (DCO)
  • Application Optimized
  • I/O Optimized (WIO)
  • Twin
  • TwinPro™
  • FatTwin™
  • BigTwin™
  • GPU/Coprocessor
  • SuperWorkstation
  • SuperStorage
  • SuperBlade®
  • MicroBlade
  • MicroCloud
  • Max IO

The latest generation X11 platforms enable Supermicro to offer the most extensive and technologically advanced range of computing solutions for Data Center, Enterprise, Cloud, HPC, Hadoop/Big Data, Storage, and Embedded environments.

Power efficiency in high availability, mission-critical applications is increased with upgraded high speed cooling architectures including high-speed fans, high-efficiency redundant Titanium Level (96%+) Digital Switching power supplies, BBP® (Battery Backup Power) and integrated SuperCap (CacheVault) power supply technologies.

When combined with full Rack Integration Services, Hardware Maintenance Services, and new Data Center Management Software that manages health, power, and maintenance of servers in large deployments, Supermicro New Generation X11 Serverboard, Chassis, SuperServer®, SuperWorkstation, SuperStorage, and SuperBlade® platforms provide the most complete, scalable computing solutions with maximum performance and the highest levels of efficiency and reliability.


BigTwin
BigTwin™
6 NVMe per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 6 Hot-swap 2.5" NVMe drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3/SATA3 +
2 SAS3/SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
  • 1 PCI-E 3.0 x16 Low-profile slot, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3/SATA3 +
2 SAS3/SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SATA3 +
2 SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 4 Hot-swap 2.5" NVMe/SATA3 + 2 Hot-swap 2.5" SATA3 drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
6 SATA3 per Node


  • 4 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 6 Hot-swap 2.5" SATA3 drive bays per node
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
4 NVMe/SAS3 +
8 SAS3 per Node


  • 2 DP nodes in 2U; depth 28.5", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 4 NVMe/SAS3 + 8 SAS3 Hot-swap 2.5" drive bays per node
  • SAS3 (12Gbps) support via Broadcom 3216; IT mode
  • 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
TwinPro
2 Hot-swappable DP nodes in 1U

 / 

  • 2 Hot-swappable DP nodes in 1U; Each Node (x2 nodes) supports:
  • Dual Intel® Xeon® Scalable processors
  • 16 DIMM slots; up to 2TB ECC DDR4‑2666MHz memory
  • 2 PCI-E 3.0 x16 slots and 1 SIOM slot for flexible Networking options (SIOM must bundle 1 per node)
  • Storage Drive Options:
    • SYS-1029TP-DTR - 4 Hot-swap 2.5" SATA3 (Intel C621)
    • SYS-1029TP-DC0R - 4 Hot-swap 2.5" SAS3 (Broadcom 3008)
    • SYS-1029TP-DC1R - 4 Hot-swap 2.5" SAS3 (Broadcom 3108)
  • 1 Video, 2 USB 3.0, 2 SuperDOM, 2 SATA M.2 or 1 NVMe M.2 (optional carrier card AOC-SMG3-2H8M2, support 1029TR-DTR/DC0R)
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 3 heavy duty counter rotating fans with air shroud
  • 1000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
TwinPro² (SIOM)
Flexible Storage Options

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 / 
 / 
 / 
 / 

  • 4 DP nodes in 2U; depth 28.5" (2029TP) / 30.5" (6029TP), Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • Storage Drive Options:
    • SYS-2029TP-HTR - 6 Hot-swap 2.5" SATA3
    • SYS-2029TP-HC0R - 6 Hot-swap 2.5" SAS3 (Broadcom 3008)
    • SYS-2029TP-HC1R - 6 Hot-swap 2.5" SAS3 (Broadcom 3108)
    • SYS-6029TP-HTR - 3 Hot-swap 3.5" SATA3
    • SYS-6029TP-HC0R - 3 Hot-swap 3.5" SAS3 (Broadcom 3008)
    • SYS-6029TP-HC1R - 3 Hot-swap 3.5" SAS3 (Broadcom 3108)
  • 2 PCI-E 3.0 x16 Low-profile slots
  • 1 SIOM card support for flexible networking options
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 2 SuperDOM
  • 4 Heavy duty 8cm fans with optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
8 2.5" + 8 2.5"
SAS3 via Broadcom 3108

 / 

  • Compute Intensive Application/Storage, Big Data Analytics, DB Application/Processing, Mission-critical Application, Simulation and Automation
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Hot-swap 2.5" SAS3 drives (via Broadcom 3108), 8 Hot-swap 2.5" SATA3 drives (via Intel C620 series chipset)
  • 4 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 slots
  • 2x 10GBase-T (-C1RT) / 1GbE (-C1R), 1 Dedicated IPMI port
  • 1 Video, 2 COM, 2 USB 3.0, 4 USB 2.0, 1 Type A, 1 M.2 support
  • 3 Hot-swap 80mm PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Mainstream
Cost Effective

 / 

  • Cloud, Virtualization, Compute Intensive App, DB Processing/Storage, High Availability Storage, Hosting & Application Delivery
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Hot-swap 3.5" SATA3 drive bays, 2 Optional fixed NVMe drives
  • 4 PCI-E 3.0 x16 and 2 PCI-E 3.0 x8 Low-profile slots
  • 2x 10GBase-T (-TRT) / 1GbE (-TR) ports, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 4 USB 2.0, 1 Type A, 1 M.2 support
  • 3 heavy duty 80mm fans with PWM fan speed control
  • 1000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
8 Hot-swap 3.5" Bays
3 Peripheral 5.25" bays
Cost Effective

 / 

  • 4U Mainstream Server for Virtualization and Multi Tasking
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Hot-swap 3.5" SATA3 drive bays, 3 Peripheral 5.25" bays, 2 opt. fixed 2.5" SATA, SSD/NVMe
  • 4 PCI-E 3.0 x16 and 2 PCI-E 3.0 x8 slots
  • 2x 10GBase-T (-TRT) / 1GbE (-TR) ports, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 4 USB 2.0, 1 Type A, 1 M.2 support
  • 3 Hot-swap PWM cooling fans and 2 Hot-swap rear fans
  • 1280W Redundant Platinum Level Power Supplies
 
BigTwin
Mainstream, UP


  • Web Hosting, VM, Application and Data Serving, DB Applications
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 4 Hot-swap 3.5" SATA3 drive bays, M.2 mini-PCI-e support
  • 1 PCI-E 3.0 x16 slot
  • 2x 10GBase-T ports, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
  • 4x 40mm mid-fan
  • 350W Platinum Level Power Supply
 
BigTwin
Mainstream, UP


  • Web Hosting, VM, Application and Data Serving, DB Applications, Mission-critical Applications
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 4 Hot-swap 3.5" SATA3 drive bays, M.2 mini-PCI-e support
  • 1 PCI-E 3.0 x16 slot
  • 2x 10GBase-T ports, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
  • 4x 40mm mid-fan
  • 400W Redundant Platinum Level Power Supplies
 
BigTwin
Mainstream, UP


  • Web Hosting, VM, Compact Network Appliance
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 768GB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 4 Hot-swap 3.5" SATA3 drive bays, M.2 PCIe 3.0 x4
  • 1 PCI-E 3.0 x16 slot
  • 2x 1GbE ports, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
  • 4x 40mm mid-fan
  • 350W Platinum Level Power Supply
 
BigTwin
Mainstream, UP


  • Web Hosting, VM, Compact Network Appliance
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 768GB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 4 Hot-swap 3.5" SATA3 drive bays, M.2 PCIe 3.0 x4
  • 1 PCI-E 3.0 x16 slot
  • 2x 1GbE ports, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
  • 4x 40mm mid-fan
  • 400W Redundant Platinum Level Power Supply
 
BigTwin
Short Depth (19.98")
Data Center Optimized


  • 1U Data Center Optimized Server, Short-Depth
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Hot-swap 2.5" SATA3 drive bays
  • 1 PCI-E 3.0 x8 (FHHL) slot
  • 2x 1GbE ports, 1 Dedicated IPMI port, 1 VGA, 2 USB 2.0
  • 4x 4cm 22.5K RPM middle cooling fans
  • 600W Platinum Level Power Supply
 
BigTwin
Short Depth (19.98")
Data Center Optimized


  • 1U Data Center Optimized Server, Short-Depth
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Hot-swap 2.5" SATA3 drive bays
  • 1 PCI-E 3.0 x8 (FHHL) slot
  • 2x 1GbE ports, 1 Dedicated IPMI port, 1 VGA, 2 USB 2.0
  • 4x 4cm 22.5K RPM middle cooling fans
  • 600W Redundant Platinum Level Power Supplies
 
BigTwin
Short Depth (19.98")
Data Center Optimized


  • 1U Data Center Optimized Server, Short-Depth
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 4 Hot-swap 3.5" SATA3 drive bays
  • 1 PCI-E 3.0 x8 (FHHL) slot
  • 2x 1GbE ports, 1 Dedicated IPMI port, 1 VGA, 2 USB 2.0
  • 4x 4cm 22.5K RPM middle cooling fans
  • 500W Platinum Level Power Supply
 
BigTwin
Short Depth (19.98")
Data Center Optimized


  • 1U Data Center Optimized Server, Short-Depth
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 4 Hot-swap 3.5" SATA3 drive bays
  • 1 PCI-E 3.0 x8 (FHHL) slot
  • 2x 1GbE ports, 1 Dedicated IPMI port, 1 VGA, 2 USB 2.0
  • 4x 4cm 22.5K RPM middle cooling fans
  • 600W Redundant Platinum Level Power Supplies
 
BigTwin
20 NVMe support
24 DDR4 DIMM
2x 25G SFP28


  • Virtualization, Cloud Computing, High End Enterprise Server, SDS
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 20 Hot-swap 2.5" 7mm drive bays; up to 20 NVMe (CPU1: 8 NVMe + 2 NVMe/SAS/SATA3 hybrid, CPU2: 10 NVMe)
  • Up to 2 PCI-E 3.0 x8 (FH, FL)
  • 2x 25G SFP28 Ethernet ports, 1 Dedicated IPMI port
  • 1 VGA, 1 Serial, 3 USB 3.0 (2 rear, 1 Type A), 2 USB 2.0 (front)
  • 8 heavy duty fans w/ optimal fan speed control, 2 air shroud
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
20 NVMe support
24 DDR4 DIMM
2x 25G SFP28


  • Virtualization, Hyperconverge Storage, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 24 Hot-swap 2.5" drive bays; 20 NVMe + 4 SAS3/SATA
  • 1 PCI-E 3.0 x8 (LP)
  • 2x 25G SFP28 Ethernet ports, 1 Dedicated IPMI port
  • 2 VGA, 1 Serial, 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin


  • Virtualization, Hyperconverge Storage, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 24 Hot-swap 2.5" drive bays; 20 SAS3 + 4 SAS3/NVMe
  • 1 PCI-E 3.0 x16 (FH, 10.5"L); 5 PCI-E 3.0 x8 (FH, 10.5"L); 1 PCI-E 3.0 x8 (LP); 1 PCI-E 3.0 x8 (internal LP)
  • 4 Gigabit Ethernet ports, 1 Dedicated IPMI port
  • 2 VGA, 1 Serial, 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin


  • Virtualization, Hyperconverge Storage, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 12 Hot-swap 3.5" drive bays; Optional 8 SAS3 + 4 SAS3/NVMe
  • 1 PCI-E 3.0 x16 (FH, 10.5"L); 5 PCI-E 3.0 x8 (FH, 10.5"L); 1 PCI-E 3.0 x8 (LP); 1 PCI-E 3.0 x8 (internal LP)
  • 4 Gigabit Ethernet ports, 1 Dedicated IPMI port
  • 2 VGA, 1 Serial, 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Xeon 6144 and 12x 16GB DDR4-2666MHz included


  • Financial Analysis, Business Critical Applications, Enterprise Server
  • Dual Intel® Xeon® Gold 6144 Processors included
  • 12x 16GB DDR4‑2666MHz included
  • 8 Hot-swap 2.5" SAS3 drive bays and 2 NVMe bays
  • 2 PCI-E 3.0 x16 (FH, 10.5"/10" L), 1 PCI-E 3.0 x8 (LP),
    1 PCI-E 3.0 x8 (internal SAS3 integrated 3108)
  • 4x 1GbE ports, 1 Dedicated IPMI port
  • 1 VGA, 1 Serial, 5 USB 3.0 (2 rear, 2 via header, 1 Type A)
  • 8 heavy duty fans w/ optimal fan speed control
  • 750W Redundant Platinum Level Power Supplies
 
BigTwin
Xeon 6146 and 12x 16GB DDR4-2666MHz included


  • Financial Analysis, Business Critical Applications, Enterprise Server
  • Dual Intel® Xeon® Gold 6146 Processors included
  • 12x 16GB DDR4‑2666MHz included
  • 8 Hot-swap 2.5" SAS3 drive bays and 2 NVMe bays
  • 2 PCI-E 3.0 x16 (FH, 10.5"/10" L), 1 PCI-E 3.0 x8 (LP),
    1 PCI-E 3.0 x8 (internal SAS3 integrated 3108)
  • 4x 1GbE ports, 1 Dedicated IPMI port
  • 1 VGA, 1 Serial, 5 USB 3.0 (2 rear, 2 via header, 1 Type A)
  • 8 heavy duty fans w/ optimal fan speed control
  • 750W Redundant Platinum Level Power Supplies
 
BigTwin
Xeon 6154 and 12x
16GB DDR4-2666MHz included


  • Financial Analysis, Business Critical Applications, Enterprise Server
  • Dual Intel® Xeon® Gold 6154 Processors included
  • 12x 16GB DDR4 2666MHz included
  • 8 Hot-swap 2.5" SAS3 drive bays and 2 NVMe bays
  • 2 PCI-E 3.0 x16 (FH, 10.5"/10" L), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x8 (internal SAS3 integrated 3108)
  • 4x 1GbE ports, 1 Dedicated IPMI port
  • 1 VGA, 1 Serial, 5 USB 3.0 (2 rear, 2 via header, 1 Type A)
  • 8 heavy duty fans w/ optimal fan speed control
  • 750W Redundant Platinum Level Power Supplies
 
BigTwin
10 NVMe support
24 DDR4 DIMM
2x 10GBase-T


  • Virtualization, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 10 Hot-swap 2.5" drive bays; 4 NVMe/SAS3 hybrid + 6 NVMe ports
  • 2 PCI-E 3.0 x16 Full-height, 10.5" L slots
  • 2x 10GBase-T ports, 1 Dedicated IPMI port
  • 2 VGA (1 rear, 1 onboard), 1 Serial, 5 USB 3.0
  • 8 heavy duty fans w/ optimal fan speed control
  • 1000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
10x 2.5" SATA3 or Opt.
8x SAS3 + 2x NVMe/SATA
Flexible Network Opt.

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 / 
 / 
 / 
 / 

  • Virtualization, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 10 Hot-swap 2.5" drive bays; 10 SATA3 (2 hybrid ports - 2 NVMe opt.)
  • 2 PCI-E 3.0 x16 (FH, 10.5" L), 2 PCI-E 3.0 x8 (1 LP, 1 LP internal)
  • 2 PCI-E 3.0 x16 (FH, 10.5" L), 1 PCI-E 3.0 x8 (1 LP), 1 PCI-E 3.0 x16 (internal LP) - SYS-1029U-TR25M
  • Networking Options:
    • SYS-1029U-TR4 - 4x 1GbE ports
    • SYS-1029U-TR4T - 4x 10GBase-T ports
    • SYS-1029U-TRT - 2x 10GBase-T ports
    • SYS-1029U-TRTP - 2x 10G SFP+ ports
    • SYS-1029U-TRTP2 - 2x 10G SFP+ ports + 2x 1GbE ports
    • SYS-1029U-TR25M - 2x 25GbE SFP28 ports
  • 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
  • 5 USB 3.0 (2 rear, 2 front, 1 Type A)
  • 8 heavy duty fans w/ optimal fan speed control
  • 750W Redundant Platinum Level Power Supplies
 
BigTwin
10x 2.5" SAS3
Flexible Network Opt.

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 / 
 / 
 / 

  • Virtualization, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 10 Hot-swap 2.5" drive bays; 10 SAS3 via optional AOC
  • 2 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots (1 LP, 1 internal LP)
  • 2 PCI-E 3.0 x16 (FH, 10.5" L), 1 PCI-E 3.0 x8 (1 LP), 1 PCI-E 3.0 x16 (internal LP) - SYS-1029U-E1CR25M
  • Networking Options:
    • SYS-1029U-E1CR4 - 4x 1GbE ports
    • SYS-1029U-E1CR4T - 4x 10GBase-T ports
    • SYS-1029U-E1CRT - 2x 10GBase-T ports
    • SYS-1029U-E1CRTP - 2x 10G SFP+ ports
    • SYS-1029U-E1CRTP2 - 2x 10G SFP+ ports + 2x 1GbE ports
    • SYS-1029U-E1CR25M - 2x 25GbE SFP28 ports
  • 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 COM/Serial
  • 5 USB 3.0 (2 rear, 2 front, 1 Type A)
  • 8 heavy duty fans w/ optimal fan speed control
  • 750W Redundant Platinum Level Power Supplies
 
BigTwin
4 NVMe support
24 DDR4 DIMM
4x/2x 10GBase-T

 / 

  • Virtualization, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 4 Hot-swap 3.5" drive bays; 4 NVMe/SAS3 hybrid ports, 2 internal M.2 (1 SATA3, 1 NVMe)
  • 2 PCI-E 3.0 x16 (FH, 10.5" L), 2 PCI-E 3.0 x8 (1 LP, 1 LP internal)
  • Networking Options:
    • SYS-6019U-TN4R4T - 4x 10GBase-T ports
    • SYS-6019U-TN4RT - 2x 10GBase-T ports
  • 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
  • 3 USB 3.0 (2 rear, 1 Type A)
  • 8 heavy duty fans w/ optimal fan speed control
  • 750W Redundant Platinum Level Power Supplies
 
BigTwin
4x 3.5" SATA3
Flexible Network Opt.

 / 
 / 
 / 
 / 
 / 

  • Virtualization, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 4 Hot-swap 3.5" drive bays
  • 2 PCI-E 3.0 x16 (FH, 10.5" L), 2 PCI-E 3.0 x8 (1 LP, 1 LP internal)
  • 2 PCI-E 3.0 x16 (FH, 10.5" L), 1 PCI-E 3.0 x8 (1 LP), 1 PCI-E 3.0 x16 (internal LP) - SYS-6019U-TR25M
  • Networking Options:
    • SYS-6019U-TR4 - 4x 1GbE ports
    • SYS-6019U-TR4T - 4x 10GBase-T ports
    • SYS-6019U-TRT - 2x 10GBase-T ports
    • SYS-6019U-TRTP - 2x 10G SFP+ ports
    • SYS-6019U-TRTP2 - 2x 10G SFP+ ports + 2x 1GbE ports
    • SYS-6019U-TR25M - 2x 25GbE SFP28 ports
  • 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
  • 3 USB 3.0 (2 rear, 1 Type A)
  • 8 heavy duty fans w/ optimal fan speed control
  • 750W Redundant Platinum Level Power Supplies
 
BigTwin
24 NVMe support
4x 10GBase-T


  • Virtualization Hosting, Cloud Computing, Data Center
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 24 Hot-swap 2.5" drive bays; 24 NVMe (4 hybrid ports - SAS3 via AOC), 2 rear Hot-swap 2.5" drive bays; 2 internal M.2 (1 SATA3, 1 NVMe)
  • 2 PCI-E 3.0 x16 (FH, 10.5" L), 1 PCI-E 3.0 x8 (LP)
  • 4x 10GBase-T ports, 1 Dedicated IPMI port
  • 2 VGA (1 rear, 1 onboard), 1 Serial, 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm PWM fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
24x 2.5" Drive Bays
Opt. 20 SAS3 + 4 NVMe/SAS3
Flexible Network Opt.

 / 
 / 
 / 
 / 

  • Virtualization Hosting, Cloud Computing, Data Center
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 24 Hot-swap 2.5" drive bays; 14 SATA (opt. 20 SAS3 + 4 NVMe/SAS3)
  • Expansion Slots:
    • 8 PCI-E Slots: 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8, 1 Internal PCI-E 3.0 x8
    • 7 PCI-E Slots (SYS-2029U-TR4T): 2 PCI-E 3.0 x16, 5 PCI-E 3.0 x8
  • Networking Options:
    • SYS-2029U-TR4 - 4x 1GbE ports
    • SYS-2029U-TR4T - 4x 10GBase-T ports
    • SYS-2029U-TRT - 2x 10GBase-T ports
    • SYS-2029U-TRTP - 2x 10G SFP+ ports
    • SYS-2029U-TR25M - 2x 25GbE SFP28 ports
  • 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
  • 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm PWM fans
  • 1000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
24x 2.5" SAS3 Opt. 4 NVMe
Flexible Network Opt.

 / 
 / 
 / 
 / 

  • Virtualization Hosting, Cloud Computing, Data Center
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 24 Hot-swap 2.5" drive bays; optional 20 SAS3 + 4 NVMe/SAS3, 2 rear Hot-swap 2.5" drive bays
  • Expansion Slots:
    • 8 PCI-E Slots: 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8, 1 Internal PCI-E 3.0 x8
    • 7 PCI-E Slots (SYS-2029U-E1CR4T): 2 PCI-E 3.0 x16, 5 PCI-E 3.0 x8
  • Networking Options:
    • SYS-2029U-E1CR4 - 4x 1GbE ports
    • SYS-2029U-E1CR4T - 4x 10GBase-T ports
    • SYS-2029U-E1CRT - 2x 10GBase-T ports
    • SYS-2029U-E1CRTP - 2x 10G SFP+ ports
    • SYS-2029U-E1CR25M - 2x 25GbE SFP28 ports
  • 1 Dedicated IPMI port
  • 2 VGA (1 rear, 1 onboard), 1 Serial, 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm PWM fans
  • 1000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
12x 3.5" SATA3 Opt. 4 NVMe
Flexible Network Opt.

 / 
 / 
 / 
 / 

  • Virtualization, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 12 Hot-swap 3.5" drive bays; Optional 8 SAS3 + 4 SAS3/NVMe and 2 Rear Hot-swap 2.5" drive bays
  • Expansion Slots:
    • 8 PCI-E Slots: 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8, 1 Internal PCI-E 3.0 x8
    • 7 PCI-E Slots (SYS-6029U-TR4T): 2 PCI-E 3.0 x16, 5 PCI-E 3.0 x8
  • Networking Options:
    • SYS-6029U-TR4 - 4x 1GbE ports
    • SYS-6029U-TR4T - 4x 10GBase-T ports
    • SYS-6029U-TRT - 2x 10GBase-T ports
    • SYS-6029U-TRTP - 2x 10G SFP+ ports
    • SYS-6029U-TR25M - 2x 25GbE SFP28 ports
  • 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
  • 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty fans w/ optimal fan speed control
  • 1000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
12x 3.5" SAS3 opt. 4 NVMe
Flexible Network Opt.

 / 
 / 
 / 
 / 

  • Virtualization, Hyperconverge Storage, Cloud Computing, High End Enterprise Server
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
  • 12 Hot-swap 3.5" drive bays; 12 SAS3 via opt. AOC (4 hybrid ports - 4 NVMe opt.)
  • Expansion Slots:
    • 8 PCI-E Slots: 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8, 1 Internal PCI-E 3.0 x8
    • 7 PCI-E Slots (SYS-6029U-E1CR4T): 2 PCI-E 3.0 x16, 5 PCI-E 3.0 x8
  • Networking Options:
    • SYS-6029U-E1CR4 - 4x 1GbE ports
    • SYS-6029U-E1CR4T - 4x 10GBase-T ports
    • SYS-6029U-E1CRT - 2x 10GBase-T ports
    • SYS-6029U-E1CRTP - 2x 10G SFP+ ports
    • SYS-6029U-E1CR25M - 2x 25GbE SFP28 ports
  • 1 Dedicated IPMI port, 2 VGA (1 rear, 1 onboard), 1 Serial
  • 3 USB 3.0 (2 rear, 1 Type A)
  • 4 heavy duty 8cm PWM fans
  • 1000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
WIO, Flexible I/O
10 Hot-swap 2.5" bays
2 NVMe support


  • Cloud and other virtualization needs, hosting & application delivery, database processing & storage, simulation, automation
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 10 Hot-swap 2.5" drive bays; 8 SATA3 + 2 NVMe/SATA3 hybrid ports
  • 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
  • 1 VGA, 6 USB 3.0 (4 rear, 2 front via header)
  • 4 Counter-rotating 4cm PWM cooling fans
  • 750W Redundant Platinum Level Power Supplies
 
BigTwin
WIO, Flexible I/O
8 Hot-swap 2.5" bays
1 Slim DVD-ROM (Opt.)


  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Hot-swap 2.5" drive bays; 1 slim DVD-ROM bay (option)
  • 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 6 USB 3.0 (4 rear, 2 via header)
  • 4 Counter-rotating 4cm PWM cooling fans
  • 750W Redundant Platinum Level Power Supplies
 
BigTwin
WIO, Flexible I/O
8 Hot-swap 2.5" bays
1 Slim DVD-ROM (Opt.)


  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Hot-swap 2.5" drive bays; 1 slim DVD-ROM bay (option)
  • 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 6 USB 3.0 (4 rear, 2 via header)
  • 4 Counter-rotating 4cm PWM cooling fans
  • 600W Multi Output Platinum Level Power Supply
 
BigTwin
WIO, Flexible I/O
8x 3.5" + 2x 2.5" bays


  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Fixed 3.5" + 2 Fixed 2.5" drive bays
  • 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E NVMe M.2 SSD
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0 (rear)
  • 6 Counter-rotating 4cm PWM cooling fans
  • 650W/600W Multi-output Platinum Level Power Supply
 
BigTwin
WIO, Flexible I/O
4 Hot-swap 3.5" bays


  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 4 Hot-swap 3.5" drive bays
  • 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0 (rear)
  • 4 Counter-rotating 4cm PWM cooling fans
  • 750W Redundant Platinum Level Power Supplies
 
BigTwin
WIO, Flexible I/O
4 Hot-swap 3.5" bays


  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 4 Hot-swap 3.5" drive bays
  • 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0 (rear)
  • 4 Counter-rotating 4cm PWM cooling fans
  • 600W Multi Output Platinum Level Power Supply
 
BigTwin
WIO, Flexible I/O, UP
10 Hot-swap 2.5" bays
2 NVMe w/ AOC opt.


  • Database Processing and Storage, Data Center Applications
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 10 Hot-swap 2.5" drive bays, M.2 mini-PCI-e support
  • 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 5 Counter-rotating 4cm PWM cooling fans
  • 500W Redundant Platinum Level Power Supplies
 
BigTwin
WIO, Flexible I/O, UP
4 Hot-swap 3.5" bays


  • Database Processing and Storage, Data Center / Firewall Applications
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 4 Hot-swap 3.5" drive bays, 1 slim DVD-ROM bay, M.2 mini-PCI-e support
  • 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 5 Counter-rotating 4cm PWM cooling fans
  • 600W Multi Output Platinum Level Power Supply
 
BigTwin
WIO, Flexible I/O, UP
4 Hot-swap 3.5" bays


  • Database Processing and Storage, Data Center / Firewall Applications
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 4 Hot-swap 3.5" drive bays, M.2 mini-PCI-e support
  • 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 5 Counter-rotating 4cm PWM cooling fans
  • 500W Redundant Platinum Level Power Supplies
 
BigTwin
WIO, Flexible I/O, UP
8 Hot-swap 3.5" bays


  • Database Processing and Storage, Connectivity/Storage Computer Nodes, Data Warehouse
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 768TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Hot-swap 3.5" drive bays, 1 Slim DVD-ROM bay, M.2 mini-PCI-e support
  • 4 PCI-E 3.0 x8 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
  • 2x 10GBase-T ports via Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0 (rear), 2 USB 2.0 (rear)
  • 3 Hot-swap 8cm PWM cooling fans
  • 500W Redundant Platinum Level Power Supplies
 
BigTwin
WIO, Flexible I/O
12 Hot-swap 3.5" bays


  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 12 Hot-swap 3.5" drive bays with SES2 and Mini-i-Pass
  • 1 PCI-E 3.0 x16 (FHHL), 2 PCI-E 3.0 x8 (FHHL), 2 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0 (rear)
  • 3 high-performance 8cm heavy duty PWM fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
WIO, Flexible I/O
8 Hot-swap 3.5" and
2 Fixed 3.5" bays


  • Web Server, FireWall Applications, DNS, Print, Login, Gateway, Compact Network Appliance, Cloud Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Hot-swap 3.5" drive bays with SGPIO, 2 Fixed 3.5" drive bays
  • 4 PCI-E 3.0 x8 (FHHL), 2 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 for AOM, 1 PCI-E 3.0 x4 NVMe M.2 slot
  • 2x 1GbE ports via Intel C621, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0 (rear)
  • 3 high-performance 8cm heavy duty PWM fans
  • 1000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
11 PCI-E Slots
16 Hot-swap 2.5", 1 Peripheral 5.25"


  • 2U Max I/O Server - Expansion / Performance / Flexibility
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 Hot-swap 2.5" drive bays and 1 peripheral 5.25" bay
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4‑2666
  • 2 PCI-E 3.0 x16 (HSSI), 2 PCI-E 3.0 x16 (or 4 PCI-E x8), 4 PCI-E 3.0 x8 , 1 PCI-E 3.0 x4 (in x8 slot)
  • 1 PCI-E 3.0 x4 M.2 2280 slot from PCH
  • 2 GbE, 1 Video, 2 COM, 2 USB 3.0 (rear), 4 USB 2.0 (rear), 1 Type A
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 4x 80mm 7K RPM middle fans
  • 1000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
11 PCI-E Slots
8 Hot-swap 3.5", 2 Peripheral 5.25"


  • 3U Max I/O Server - Expansion / Performance / Flexibility
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 8 Hot-swap 3.5" SATA3 drive bays and 2 Peripheral 5.25" bays
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM or RDIMM DDR4‑2666
  • 2 PCI-E 3.0 x16 (HSSI), 2 PCI-E 3.0 x16 (or 4 PCI-E x8), 4 PCI-E 3.0 x8 , 1 PCI-E 3.0 x4 (in x8 slot)
  • 1 PCI-E 3.0 x4 M.2 2280 slot from PCH
  • 2 GbE, 1 Video, 2 COM, 4 USB 3.0 (2 rear, 2 via header), 4 USB 2.0 (2 rear, 2 via header), 1 Type A
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 3x 80mm middle fans and 1x 80mm fear exhaust fan
  • 980W Redundant Platinum Level Power Supplies
 
BigTwin
Rear I/O, 8-Node, Each:
6 Hot-swap 2.5" SAS3/SATA3/NVMe opt.

 / 
 / 
 / 

  • FatTwin™ Server; EACH NODE (x8 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • Storage Options (all Hot-swap):
    • SYS-F619P2-RT – 6x 2.5" SATA3
    • SYS-F619P2-RTN – 6x 2.5" SATA3 or 2 SATA3 + 4 NVMe U.2
    • SYS-F619P2-RC0 – 6x 2.5" SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3008
    • SYS-F619P2-RC1 – 6x 2.5" SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3108
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 1 M.2 support
  • 3x 4cm 20k RPM middle fans
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Rear I/O, 4-Node, Each:
8 Hot-swap 3.5" SAS3/SATA3/NVMe opt.

 / 
 / 
 / 

  • FatTwin™ Server; EACH NODE (x4 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • Storage Options (all Hot-swap):
    • SYS-F629P3-RTB – 8x 3.5" SATA3
    • SYS-F629P3-RTBN – 8x 3.5" SATA3 or 6 SATA3 + 2 NVMe U.2
    • SYS-F629P3-RC0B – 8x 3.5" SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3008
    • SYS-F629P3-RC1B – 8x 3.5" SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3108
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 1 M.2 support
  • 2x 8cm 14k RPM middle fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Up to 2 NVIDIA GPUs in 1U


  • HPC cluster computer nodes
  • Single Socket P (LGA 3647) supports: Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 768GB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 6 Hot-swap 2.5" SAS/SATA drive bays
  • 2 PCI-E 3.0 x16 (right riser) and 1 PCI-E x16 (left riser) slots
  • 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear)
  • 8 heavy duty 4cm counter-rotating fans with air shroud
  • 1400W Platinum Level (94%) Power Supply
 
BigTwin
Up to 2 NVIDIA GPUs in 1U


  • HPC cluster computer nodes
  • Single Socket P (LGA 3647) supports: Intel® Xeon® Scalable processors
  • 6 DIMMs; up to 768GB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 Hot-swap 3.5" SAS/SATA drive bays
  • 1 slim DVD-ROM bay or 1 USB + COM port tray
  • 2 PCI-E 3.0 x16 (right riser) and 1 PCI-E x16 (left riser) slots
  • 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0 (rear)
  • 8 heavy duty 4cm counter-rotating fans with air shroud
  • 1400W Platinum Level (94%) Power Supply
 
BigTwin
Up to 4 NVIDIA Tesla P100 SXM2 GPUs


  • HPC, Artificial Intelligence, Big Data Analytics, Research Lab, Astrophysics, Business Intelligence
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 2 Hot-swap 2.5" drive bays, 2 Internal 2.5" drive bays
  • 4 PCI-E 3.0 x16 slots
  • 2x 10GBase-T ports via Intel X540, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0 (rear)
  • 7x 4cm heavy duty counter-rotating fans with air shroud
  • 2000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Up to 4 NVIDIA GPUs in 1U


  • GPU Server, Mission-critical app., enterprise server, oil & gas, financial, 3D rendering, chemistry, HPC
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 2x Hot-swap 2.5" drive bays, 2 Internal 2.5" drive bays
  • 4 PCI-E 3.0 x16 (FHFL) and 2 PCI-E x16 (LP) slots
  • 2x 10GBase-T ports via Intel X540, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0 (rear)
  • 9x 4cm heavy duty counter-rotating fans with air shroud
  • 2000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Up to 4 GPUs in 1U


  • High-performance Computing, Big Data Analytics, Business Intelligence, Research Lab, Astrophysics
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 2 Hot-swap 2.5" drive bays, 2 Internal 2.5" drive bays
  • 4 PCI-E 3.0 x16 (FHFL), 1 PCI-E x16 (LP), and 1 PCI-E 3.0 x8 (LP) slots
  • 2x 10GBase-T ports via Intel X540, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0 (rear)
  • 9x 4cm heavy duty counter-rotating fans with air shroud
  • 2000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Up to 2 GPUs
7.1 HD Audio


  • CAD/CAM/CAE, 3D Rendering, Digital Content Creation, Oil and Gas Simulation, Research lab/National Lab
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 4x 3.5" drive bays supported by 90° rotating hard drive cage
  • Optional 4x 2.5" internal drive bays (supports 2 NVMe via opt. cables)
  • 2x 5.25" Peripheral drive bays
  • 4 PCI-E 3.0 x16, 2 PCI-E x8
  • 2x 1GbE, 1 shared IPMI port
  • 1 VGA, 1 COM, 6 USB 3.0, 2 USB 3.1, M.2, 7.1 HD Audio
  • 1 rear 12cm exhaust fan, 1 front 12cm cooling fan
  • 1200W Platinum Level Power Supply
 
BigTwin
Up to 2 GPUs
7.1 HD Audio


  • 4U Workstation for Virtualization and Multi Tasking
  • CAD/CAM/CAE, 3D Rendering, Digital Content Creation, Oil and Gas Simulation, Research lab/National Lab
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Hot-swap 3.5" drive bays (SATA3 by default, SAS3 via opt. AOC, 2 NVMe support with optional cables)
  • 4 PCI-E 3.0 x16, 2 PCI-E x8
  • 2x 1GbE ports, 1 shared IPMI port
  • 1 VGA, 1 COM, 6 USB 3.0, 2 USB 3.1, M.2, 7.1 HD Audio
  • 2 Super quiet PWM fans and 1 Super quiet rear fan
  • 1200W Platinum Level Power Supply
 
BigTwin
Up to 4 GPUs


  • GPU Server, Mission-critical app., enterprise server, large database, e-business, on-line transaction processing, oil & gas, medical app.
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Hot-swap 3.5" drive bays (2 SATA3 ports by default)
  • 4 PCI-E 3.0 x16 (double-width), 2 PCI-E 3.0 x16 (single-width), 1 PCI-E x4 (in x8) slots
  • 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 4 USB 3.0 (front/rear), 2 USB 2.0
  • 4 heavy duty fans, 4 exhaust fans, 2 active heat sinks with optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
12 Hot-swap 3.5"
SAS3/SATA3 + 4 Hot-
swap 2.5" NVMe/SATA


  • High Density Storage, Object Storage 1U, Ceph / Hadoop, Scale-out Storage, Big Data Analytics
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 4 Hot-swap 2.5" NVMe/SATA drive bays
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
  • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0, 1 TPM header
  • 6x 4cm 20.5K RPM cooling fans
  • 600W Redundant Platinum Level Power Supplies
 
BigTwin
24 Hot-swap 2.5" SAS3/SATA3

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 Hot-swap 2.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-2029P-ACR24H - SAS3 via Broadcom 3108 AOC
    • SSG-2029P-ACR24L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
24 Hot-swap 2.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 Hot-swap 2.5" SAS3/SATA3 drive bays
  • Storage Options:
    • SSG-2029P-E1CR24H - SAS3 via Broadcom 3108 AOC
    • SSG-2029P-E1CR24L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
24 Hot-swap 3.5" SAS3/SATA3 drive bays + 2 Hot-swap 2.5" drive bays (rear)

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Hot-swap 2.5" drive bays (rear)
  • Storage Options:
    • SSG-6029P-E1CR24H – SAS3 via Broadcom 3108 AOC
    • SSG-6029P-E1CR24L – SAS3 via Broadcom 3008 AOC
  • 24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4 2400MHz
  • 2 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 slots
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 80mm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
12 Hot-swap 3.5" SAS3/SATA3
SAS3 via Broadcom 3108


  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 12 Hot-swap 3.5" SAS3 (via Broadcom 3108)/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
12 Hot-swap 3.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6029P-E1CR12H - SAS3 via Broadcom 3108 AOC
    • SSG-6029P-E1CR12L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
16 Hot-swap 3.5" SAS3/SATA3
SAS3 via Broadcom 3108


  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 Hot-swap 3.5" SAS3 (via Broadcom 3108)/SATA3 drive bays
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
16 Hot-swap 3.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6039P-E1CR16H - SAS3 via Broadcom 3108 AOC
    • SSG-6039P-E1CR16L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 3 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
24 Hot-swap 3.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24" Hot-swap 3.5 SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6049P-E1CR24H - SAS3 via Broadcom 3108 AOC
    • SSG-6049P-E1CR24L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 4 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
36 Hot-swap 3.5" SAS3/SATA3
Dual JBOD Exp. Ports

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 36 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional onboard NVMe M.2
  • Storage Options:
    • SSG-6049P-E1CR36H - SAS3 via Broadcom 3108 AOC
    • SSG-6049P-E1CR36L - SAS3 via Broadcom 3008 AOC
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8; Dual JBOD Expansion ports (slot 2 & 3 occupied by controller and JBOD expansion port)
  • 2x 10GBase-T ports via Intel X722 + PHY Intel X557, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 4 USB 3.0, 1 Type A
  • 3 Hot-swap 8cm redundant PWM cooling fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
12 Hot-swap 3.5" SAS3/SATA3


  • Application and data serving, Connectivity/Storage Compute Nodes, High Availability Storage Appliance Platform
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 12 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional NVMe/SATA (rear)
  • SAS3 via Broadcom 3008 controller
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2x 10GBase-T ports via X557, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 3 High-performance 80mm PWM fans
  • 800W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
36 Hot-swap 3.5" SAS3/SATA3


  • Connectivity/Storage Compute Nodes, Database Processing & Storage Appliance Platform
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 36 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 Optional NVMe/SATA (rear)
  • SAS3 via Broadcom 3008 controller
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 1 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2x 10GBase-T ports via Intel X722 + X557, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 7 High-performance 80mm PWM fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
2U Ultra 4-Way
112 Cores per System
48 DDR4 DIMMs


  • High End Enterprise Server, in-memory database, Business Intelligence, High Performance Computer Cluster, Virtualization, ERP, CRM
  • Quad Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 11 PCI-E 3.0 total: 5 PCI-E 3.0 x8 and 6 PCI-E 3.0 x16 slots
  • 48 DIMMs, up to 6TB ECC 3DS LRDIMMs, up to DDR4‑2666MHz
  • 24 Hot-swap 2.5" drive bays: 4 U.2 NVMe + 20 SAS3 opt. via AOC
  • 4 GbE via AOC, 1 dedicated IPMI
  • 1 VGA, 1 COM, 2 USB 3.0 (rear)
  • 4 heavy duty 8cm PWM fans
  • 1600W (1+1) Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
7U 8-Way
224 Cores per System
96 DDR4 DIMMs


  • In-Memory Database Application, Research lab/National Lab, Scale-up HPC, Virtualization, ERP, CRM
  • Octa Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 8S-3 UPI up to 10.4GT/s
  • Up to 23 or 39 (OEM) PCI-E 3.0 slots, 32 U.2 NVMe support opt. available
  • 96 DIMMs, up to 12TB ECC 3DS LRDIMMs, up to DDR4‑2666MHz
  • 16 Hot-swap 2.5" SAS3 drive bays (w/ RAID cards); 8x 2.5" or 6x 3.5" internal drive bays (w/ RAID cards)
  • 4x 10GBase-T via SIOM, 1 dedicated IPMI
  • 1 VGA, 1 COM, 2 USB 2.0 (rear)
  • 8x 9cm 10.5K-10.8K RPM Hot-Swap Counter-rotating Rear Fans
  • 5x 1600W (N+2) Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Up to 3 NVIDIA GPUs


  • 2D/3D and CAD Applications, Astrophysics, Chemistry, Cloud and Virtualization
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 2 Hot-swap 2.5" SAS/SATA drive bays, 2 Hot-swap 2.5" SAS/SATA/NVMe drive bays
  • 4 PCI-E 3.0 x16 (FHFL) and 1 PCI-E 3.0 x8 (in x16, LP) slots
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0 (rear)
  • 10x 4cm heavy duty counter-rotating fans with air shroud
  • 1600W Redundant Platinum Level (94%) Power Supplies
 
BigTwin


  • IOPS Intensive Storage App., DB App. (MySQL, Casandra), Hyperconverged Infrastructure / Scale-out Architectures
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 32 Hot-swap NF1 drive bays, 4 hybrid PCI-E NF1 or SATA3 M.2 drive bays
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x4
  • 2x 10GBase-T ports via Intel X550, 1 Dedicated IPMI port
  • 1 VGA, 4 USB 3.0, 1 TPM header
  • 8x 4cm counter-rotating cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin


  • 2U 2-Node Mission critical storage server
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 12 DIMMs; Up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz;
  • 2 PCI-E 3.0 x16 Low-profile slots
  • 1 SIOM card support for flexible networking options
  • Dual port 10GBase-T (Intel® X557-AT2), 1 Dedicated IPMI port.
  • 1 VGA, 2 USB 3.0, 1 Type A,1x TPM header
  • 5x 8cm high-performance PWM fans w/ optimal fan speed control.
  • Lowest latency:
    • 24 U.2 Hot-swap dual-port NVMe drive bays
    • Omni-Path SIOM support
  • Robust Data Availability:
    • Shared storage between redundant controllers
    • Node to node heartbeat/ NTB connectivity
    • Dual 10G private Ethernet between nodes
    • Redundant power supply and cooling system
  • Greener Storage:
    • Titanium Level (96%+) efficiency 2000W redundant power supplies
    • 90%+ VRM power efficiency
Titanium Level
 
BigTwin
48 Hot-swap 2.5" SAS3/SATA3 drive bays + 2 Hot-swap 2.5" drive bays (rear)

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 48 Hot-swap 2.5" SAS3/SATA3 drive bays, 2 Hot-swap 2.5" drive bays (rear)
  • Storage Options:
    • SSG-2029P-E1CR48H – SAS3 via Broadcom 3108 AOC
    • SSG-2029P-E1CR48L – SAS3 via Broadcom 3008 AOC
  • 24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4 2400MHz
  • 2 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 slots
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 80mm redundant PWM cooling fans
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin

 / 

  • Backup Storage, Cold Storage; Database Applications; Data Warehousing, Archiving
  • Single Socket P (LGA 3647) support: Intel® Xeon® Scalable processors
  • 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays (NVMe/SATA optional)
  • Storage Options:
    • SSG-5049P-E1CR45H – SAS3 via Broadcom 3108 AOC
    • SSG-5049P-E1CR45L – SAS3 via Broadcom 3008 AOC
  • 8 DIMMs; up to 1TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
  • 2 GbE LAN ports via Intel i210, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0, 2 USB 2.0
  • 5 Hot-swap 8cm redundant PWM fans
  • 1600W Redundant Platinum Level Power Supplies
 
BigTwin

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays, 6 optional NVMe bays
  • Storage Options:
    • SSG-6049P-E1CR45H – SAS3 via Broadcom 3108 AOM
    • SSG-6049P-E1CR45L – SAS3 via Broadcom 3008 AOM
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card slot
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 8cm rear exhaust PWM cooling fans
  • 1600W Redundant Platinum Level Power Supplies
 
BigTwin


  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays, 6 optional NVMe bays
  • Storage Options:
    • SSG-6049P-E1CR45L+ – SAS3 via Broadcom 3616 AOM
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card slot
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 8cm rear exhaust PWM cooling fans
  • 1600W Redundant Platinum Level Power Supplies
 
BigTwin

 / 

  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 60 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays
  • Storage Options:
    • SSG-6049P-E1CR60H – SAS3 via Broadcom 3108 AOM
    • SSG-6049P-E1CR60L – SAS3 via Broadcom 3008 AOM
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 8cm rear exhaust PWM cooling fans
  • 2000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin


  • Corporate Database, Database Processing & Storage, Enterprise Server, HPC, Data Center, iSCSI SAN
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 60 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5” drive bays
  • Storage Options:
    • SSG-6049P-E1CR60L+ – SAS3 via Broadcom 3616 AOM
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0, 1 Type A
  • 5 Hot-swap 8cm rear exhaust PWM cooling fans
  • 2000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Up to 4 NVIDIA Tesla
V100 SXM2 GPUs
Up to 300 GB/s
GPU-to-GPU NVLINK


  • HPC, Artificial Intelligence, Big Data Analytics, Research Lab, Astrophysics, Business Intelligence
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 2 Hot-swap 2.5" drive bays, 2 Internal 2.5" drive bays
  • 4 PCI-E 3.0 x16 slots
  • 2x 10GBase-T ports via Intel X540, 1 Dedicated IPMI port
  • 1 VGA, 2 COM, 2 USB 3.0 (rear)
  • 7x 4cm heavy duty counter-rotating fans with air shroud
  • 2000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
32 NVMe Support
(2 sleds with 16 drives per sled)


  • High Throughput Ingest, High Density Hot Storage, HPC / Data Analytics, Media/Video Streaming, Content Delivery Network (CDN), Big Data Top of Rack Storage
  • Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
  • 32 Hot-swap 2.5" NVMe SSDs (2 sleds with 16 drives per sled), 2 M.2 boot drives
  • 24 DIMMs; Up to 3TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 2 PCI-E 3.0 x16 slots
  • 2x 10GBase-T LAN ports, 1 dedicated IPMI Port
  • 1 VGA, 2 USB 3.0, 1 COM, 2 SuperDOM
  • Built-in Intel® QAT for Crypto/Compression
  • 8 Hot-swap 40mm cooling fans
  • 1600W Redundant Platinum Level Power Supplies
 
BigTwin
32 NVMe Ruler SSDs


  • High Throughput Ingest, High Density Hot Storage, HPC / Data Analytics, Media/Video Streaming, Content Delivery Network (CDN), Big Data Top of Rack Storage
  • Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
  • 32 Hot-swap NVMe Ruler SSDs, 2 M.2 boot drives
  • 24 DIMMs; Up to 3TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 2 PCI-E 3.0 x16 slots
  • 2x 10GBase-T LAN ports, 1 dedicated IPMI Port
  • 1 VGA, 2 USB 3.0, 1 COM, 2 SuperDOM
  • Built-in Intel® QAT for Crypto/Compression
  • 8 Hot-swap 40mm cooling fans
  • 1600W Redundant Platinum Level Power Supplies
 
BigTwin
BigTwin™
6 NVMe per Node
N+1 Cooling


  • 4 DP nodes in 2U; depth 28.75", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4 2666MHz
  • 6 Hot-swap 2.5" NVMe drive bays per node; 2 M.2 SATA3 or NVMe support
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 16 Heavy duty 40x56mm fans w/ optimal fan speed control (4 fans per node)
  • 2600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Up to 6 NVIDIA GPUs


  • GPU Server, Mission-critical app., enterprise server, oil & gas, large database, e-business, on-line transaction processing, medical
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 16 DIMMs; up to 2TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 8 Hot-swap 2.5" SAS/SATA drive bays, 2 Hot-swap 2.5" SAS/SATA/NVMe drive bays
  • 6 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 (in x16) slots
  • 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0 (rear)
  • 5 heavy duty fans w/ optimal fan speed control
  • 2000W Redundant Platinum Level Power Supplies
 
BigTwin
Up to 8 NVIDIA GPUs


  • 3D rendering, Astrophysics, Chemistry, Cloud Computing, Virtualization, Compute intensive application
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • Up to 24 Hot-swap 2.5" Drive Bays, 8x 2.5” drives supported natively
  • 24 DIMM slots; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4 2400MHz
  • 8 PCI-E 3.0 x16 (double-width), 2 PCI-E 3.0 x8 slots, 1 PCI-E 2.0 x4 slot
  • I/O ports: 2x 10GBase-T, 1 Video, 1 COM, 4 USB 3.0
  • System management: Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port
  • 8x 92mm RPM Hot-Swappable Cooling Fans
  • 2000W (2+2) Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Up to 8 GPUs


  • Artificial Intelligence, Big Data Analytics, High-performance Computing, Research Lab/National Lab, Astrophysics, Business Intelligence
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 24 Hot-swap 2.5" drive bays (8x 2.5" drives supported natively)
  • 11 PCI-E 3.0 x16 (FH, FL) and 1 PCI-E 3.0 x8 (in x16) slots
  • 2x 10GBase-T ports via Intel C622, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 4 USB 3.0
  • 8x 92mm Hot-swap cooling fans
  • 2000W (2+2) Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Up to 8 NVIDIA Tesla
V100 SXM2 GPUs
Up to 300 GB/s
GPU-to-GPU NVLINK


  • Artificial Intelligence, Big Data Analytics, High-performance Computing, Research Lab/National Lab, Astrophysics, Business Intelligence
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 16 Hot-swap 2.5" drive bays (support 8 NVMe drives)
  • 4 PCI-E 3.0 x16 (LP, GPU tray for GPUDirect RDMA), 2 PCI-E 3.0 x16 (LP, CPU tray)
  • 2x 10GBase-T ports via Intel X540, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0 (front)
  • 8x 92mm cooling fans, 4x 80mm cooling fans
  • 2200W (2+2) Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin


  • Designed for Content Creation, Engineering and  Scientific applications
  • Single socket R4 supports Intel® Xeon® processor W Family; Intel® C422 Chipset
  • 4 Fixed 3.5" drive bays; 2 optional 5.25" Peripheral drive bays
  • 3 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 slots, 2 U.2, 2 M.2 M key
  • Up to 512GB Registered ECC LRDIMMs, up to DDR4‑2666MHz; in 8 DIMM slots
  • Dual GbE LAN ports
  • 6 SATA3 ports via PCH; RAID 0, 1, 5, 10
  • 2 USB 3.1 (2 Type A), 6 USB 3.0 (4 rear, 2 headers), 6 USB 2.0 (2 rear, 4 headers)
  • ALC 1220 7.1 HD Audio
  • 1x 12cm front cooling fan
  • 900W High Efficiency Power Supply
 
BigTwin
BigTwin™
3 NVMe/SAS3 + 3 SAS3 per Node


  • 2 DP nodes in 2U; depth 30.11", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processor; dual UPI up to 10.4GT/s
  • 24 DIMM slots; up to 3TB ECC 3DS L/RDIMM, up to DDR4‑2666MHz
  • 3 NVMe/SAS3 + 3 SAS3 Hot-swap 3.5" drive bays per node, 2 Internal M.2 NVMe/SATA slots
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
BigTwin™
3 NVMe/SAS3 per Node


  • 4 DP nodes in 2U; depth 30.11", Each Node:
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMM slots; up to 3TB ECC 3DS L/RDIMM, up to DDR4‑2666MHz
  • 3 Hot-swap NVMe/SAS3 drive bays per node
  • SAS3 support via Broadcom 3008; IT mode
  • 2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
  • 1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
  • 4 heavy duty 80mm fans w/ optimal fan speed control
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin


  • 2 DP nodes in 2U; depth 28.5", Each Node (x2 nodes):
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; Dual UPI up to 10.4GT/s
  • 8 DIMM slots; up to 1TB ECC 3DS LRDIMM or RDIMM DDR4 2666MHz
  • 2 PCI-E 3.0 x8 (FHHL) or 1 PCI-E 3.0 x8 (FHHL) + 1 PCI-E 3.0 x4 (FHHL) + 1 PCI-E 3.0 x4 (LP) (8/8/0 or 8/4/4)
  • 6 Hot-swap 3.5" SATA3 drive bays
  • 2x 1GbE LAN ports, 1 dedicated IPMI port
  • I/O ports: 2 USB 3.0, 1 VGA, 1 COM, TPM 2.0 header
  • 4 heavy duty fans w/ optimal fan speed control
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin


  • 4 DP nodes in 2U, depth 28.5", Each Node (x4 nodes):
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; Dual UPI up to 10.4GT/s
  • 8 DIMM slots; up to 1TB ECC 3DS LRDIMM or RDIMM DDR4 2666MHz
  • 1 PCI-E 3.0 x16 (LP) slot
  • 3 Hot-swap 3.5" SATA3 drive bays
  • 2x 1GbE LAN ports, 1 dedicated IPMI port
  • I/O ports: 2 USB 3.0, 1 VGA, 1 COM, TPM 2.0 header
  • 4 heavy duty fans w/ optimal fan speed control
  • 1600W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Up to 16 V100 SXM3 GPUs


  • AI/Deep Learning, High-performance Computing
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 24 DIMMs; up to 3TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • 16 Hot-swap 2.5" NVMe drive bays, 6 Hot-swap 2.5" SATA3 drive bays
  • 16 PCI-E 3.0 x16 slots for RDMA via IB EDR, 2 PCI-E 3.0 x16 on board
  • 2x 10GBase-T ports via Intel X540, 1 Dedicated IPMI port
  • 1 VGA, 1 COM, 2 USB 3.0 (front)
  • 6x 80mm hot-swap PWM Fans, 8x 92mm Hot-swap Fans
  • 6x 3000W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Front I/O, 8-Node,
Each: 2/4 Fixed 2.5" SATA3/ NVMe


  • FatTwin™ Server; EACH NODE (x8 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 or 4 Fixed 2.5" SATA3/NVMe drive bays
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 2 M.2 support
  • 8x 8cm 13.5k RPM rear fans
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Rear I/O, 8-Node, Each:
6 Hot-swap 2.5"

 / 
 / 

  • FatTwin™ Server; EACH NODE (x8 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: 
  • Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • Storage Options (all Hot-swap):
    • SYS-F619P2-RTN – 6x 2.5" SATA3 or 2 SATA3 + 4 NVMe U.2
    • SYS-F619P2-RC0 – 6x 2.5" SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3008
    • SYS-F619P2-RC1 – 6x 2.5" SAS3 or 2 SAS3 + 4 opt. NVMe U.2; SAS3 with Broadcom 3108
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 1 M.2 support
  • 3x 4cm 20k RPM middle fans
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Front I/O, 8-Node,
Each: 2 Fixed 3.5" SATA3


  • FatTwin™ Server; EACH NODE (x8 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4 2666MHz
  • 2 Fixed 3.5" SATA3 drive bays
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 2 M.2 support
  • 8x 8cm 13.5k RPM rear fans
  • 2200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 
BigTwin
Rear I/O, 4-Node, Each:
8 Hot-swap 3.5"

 / 
 / 

  • FatTwin™ Server; EACH NODE (x4 Hot-plug System Nodes):
  • Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
  • 12 DIMMs; up to 1.5TB ECC 3DS LRDIMM, up to DDR4‑2666MHz
  • Storage Options (all Hot-swap):
    • SYS-F629P3-RTBN – 8x 3.5" SATA3 or 6 SATA3 + 2 NVMe U.2
    • SYS-F629P3-RC0B – 8x 3.5" SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3008
    • SYS-F629P3-RC1B – 8x 3.5" SAS3 or 6 SAS3 + 2 opt. NVMe U.2; SAS3 with Broadcom 3108
  • 1 PCI-E 3.0 x16 (LP), 1 PCI-E 3.0 x16 (SIOM)
  • SIOM flexible Network card, 1 Dedicated IPMI port
  • 1 VGA, 2 USB 3.0, 1 M.2 support
  • 2x 8cm 14k RPM middle fans
  • 1200W Redundant Titanium Level (96%) Power Supplies
Titanium Level
 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2666MHz
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


Intel®, Intel® Xeon® , Intel® Xeon® are trademarks of Intel Corporation in the United States and other countries

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